View of the SMT line at OSI Electronic UK's St Neots factory. There are five PCB (printed circuit baord) lines, including one dedicated to fast prototype production.

PCB assembly

We manufacture complete printed circuit board assemblies – surface mount and through-hole – configured to meet the design, specification and volume of your project.

Our facilities include:

  • Five automated PCB assembly lines
  • Selective soldering.
  • Vapour phase reflow.
  • Conformal coating.
  • Aqueous three-stage cleaning.

Out-of-the-ordinary PCB capablities include flip chips, package-on-package (PoP), plugged, blind and buried vias, flexible circuits, thermal substrates and x-ray inspection.

As it leaves the production line, each PCB is automatically inspected with state-of-the-art AOI equipment (with manual inspection if required) to ensure the board is 100% defect-free before other assembly work.

SMT – surface mount
Our surface mount capability is at the heart of our business, with four SMT lines to deliver the highest quality product with the greatest

Our surface mount capability is at the heart of our business, with four SMT lines to deliver the highest quality product with the greatest flexibility and a fifth line for fast prototype production, within days if needs be – see our Fast prototype service page.

We can place components as small as 01005 passives, 0.3 mm pitch and BGAs with a pitch of 0.428 mm and up to 1900 ball devices..

Upon completion of the SMT assembly stage, each board is carefully checked using our Mirtec AOI systems in combination with a Dage XiDAT x-ray real time system to verify the soldering of BGAs, LGAs, QFNs and PoP packages meet IPC-A-610 Class 3 standards.

In addition to our on-line equipment, we have also made a considerable investment in our off-line facilities including extra interchangeable carts for rapid change over and improved lead-times.

Component purchase
What else?  Well, back to the beginning, for we purchase components – electronic, mechanical and fabricated – from suppliers around the world to suit

What else?  Well, back to the beginning, for we purchase components – electronic, mechanical and fabricated – from suppliers around the world to suit your project and cost objectives.  Full traceability is one of many options we offer.

And we also hold an extensive range of ‘common’ electronic components in stock; moisture sensitive devices are kept in accordance with manufacturer – or your free issue – recommendations, including bake and vacuum sealing, or put in one of our dry stores to ensure their shelf life is maintained.

Do go to our Global procurement page for more information on our procurement process.

Engineering preparation
But before we start buying components, we like to work with you on design for manufacturing (DfM) your product to minimise costs, maximise production

But before we start buying components, we like to work with you on design for manufacturing (DfM) your product to minimise costs, maximise production efficiencies and plan the best test procedures.

If you need help with PCB design, we work closely with design contractors who specialise in all types of circuit board technology.

That way your product is optimised for efficient assembly, testing and shipping, making everybody’s life easier – and almost always resulting in a lower price.

Naturally, with high levels of manufacturing expertise, we have very skilled teams of well-trained, experienced and helpful SMT engineering staff who understand the demands of placement accuracy and inspection.

In addition to our UK sites, we have direct access to manufacturing plants in Indonesia, Malaysia and the USA, allowing us to integrate your EMS seamlessly around the world to suit your market requirements − see our Global manufacturing page for more information.

Other key points include...
A humidity and temperature controlled manufacturing facility. Assembly of simple to very complex boards, including boards with RF components, on-board sensors and other specialist devices. Mounting
  • A humidity and temperature controlled manufacturing facility.
  • Assembly of simple to very complex boards, including boards with RF components, on-board sensors and other specialist devices.
  • Mounting of BGA, µBGA, QFN, PoP, flip-chip and LGA devices as well as QFN and fine pitch QFP packages.*
  • Fast prototyping – can be within days from receipt of engineering data.
  • Hand finishing where appropriate.
  • Fast change over, fully automated SMT assembly lines.
  • The latest flexible, high inventory placement machines.
  • Full convection re-flow ovens.
  • Component sizes from 01005 up to 55 mm square.
  • Aqueous three-stage cleaning.
  • AOI and X-ray inspection in real time.
PTH through-hole and hand assembly
As well as investing heavily in our surface mount capability, we also have a well equipped through-hole facility with skilled IPC trained operators to

As well as investing heavily in our surface mount capability, we also have a well equipped through-hole facility with skilled IPC trained operators to populate and solder components to boards to the highest quality.

For low volume and prototype builds, board production is likely to be a combination of automated component placement and skilled population and soldering by hand – for higher volume products, we have two Blundell CMS400 wave solder machines to solder ROHS and tin-lead.

Board assemblies are cleaned by a Trident aqueous three stage process.

Conformal coating
As PCBs get ever smaller and the density of components increases, the risk of shorts, corrosion and electro-migration rises substantially. With conformal coating, a very

As PCBs get ever smaller and the density of components increases, the risk of shorts, corrosion and electro-migration rises substantially.

With conformal coating, a very fine layer (typically 25 to 250 μm) of flexible polymeric film is applied to the board to protect its electronic circuits from moisture, dust, salt, chemicals and extreme temperature changes as well as the potential risk of tin and zinc whisker short circuit.

Coating boards is particularly important for the industrial, medical, aerospace and defence markets as well as other areas where safety and reliability are critical and failure in the field unacceptable.

Our PVA Delta 6 automatic conformal coating machine has a fully programmable three-axis motion platform with unparalleled motion capability, allowing it to contour in and around intricate devices with pinpoint accuracy, giving our boards full environmental protection.

It can also be configured for virtually any adhesive application, including potting and dot and bead operations.

Selective soldering
Selective soldering of through-hole components on mixed technology PCBs – often with only millimetres between solder points and the nearest SMT device – replaces

Selective soldering of through-hole components on mixed technology PCBs – often with only millimetres between solder points and the nearest SMT device – replaces traditional masking and wave soldering / hand soldering, significantly improving product quality and production throughput.

Our two automated Orissa Synchrodex 460 selective solder units accurately control nozzle flow under a hot nitrogen curtain, providing an inert atmosphere for the soldering process and minimising oxidation without damaging nearby SMT devices.

Vapour phase reflow
Our IBL BLC509 vapour phase reflow oven, using vacuum soldering technology, ensures flawless solder reflow in perfect environmental conditions, giving reliable, void-free and effective

Our IBL BLC509 vapour phase reflow oven, using vacuum soldering technology, ensures flawless solder reflow in perfect environmental conditions, giving reliable, void-free and effective safe soldering for high density, high technology boards.

The process has a wide variety of temperature profile adjustments, so any board can be soldered no matter how complicated it is, without the risk of it being over heated, and irrespective of the size, shape, colour and thermal mass involved.

During the first stage of the process, the board is immersed into a vapour, created by a liquid with a specific boiling point, typically 230°C for lead-free alloys.  As the heat of the PCB and components in the vapour can never exceed the boiling point of the liquid, the risk of over heating is eliminated.

The second stage of this process rapidly cools the boards via an inbuilt cooling unit, significantly reducing the time taken from soldering to solidification of the solder joints.  This maintains the integrity and structure of the board and is ideal for heavy boards with a large mass soldered to them.

* In case you’re not sure what these letters mean…
BGA = Ball grid array µBGA = micro-ball grid array LGA = Land grid array PoP = Package on package QFN = Quad flat pack no-lead QFP = Quad

BGA = Ball grid array
µBGA = micro-ball grid array
LGA = Land grid array
PoP = Package on package
QFN = Quad flat pack no-lead
QFP = Quad flat package

Do you have a project you’d like to discuss with us?
PCB assembly is only one part of any project.  We have a total manufacturing facility, giving you a resource to develop, make and deliver

PCB assembly is only one part of any project.  We have a total manufacturing facility, giving you a resource to develop, make and deliver complete products to anywhere in the world – as outlined in:

What we do.
Fast prototype service.
Complete product build.
Sub-system build.
Quality and environmental.
Global manufacturing

For an initial free, no obligation briefing, please phone us on +44 (0)1480 222 480 or e-mail us.








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