- Full turn-key manufacturing
- Integrated global manufacturing facilities
- State- of- the- art technologies and sites
- Highly skilled team
- Customer service focus
- Design for Excellence (DFX)
- Design for Manufacturability (DFM)
- World-class process control & data collection
- Low-mid volume, mid-high mix electronics manufacturing
- Hybrids and custom micro-electronic assemblies
- Dedicated development process from prototyping to production
- Complete mechanical assembly & configuration
- Dedicated NPI center
- Quick-turn prototyping
- 01005 components
- Box Build & System Integration
- Enclosure system configuration
- Complete assembly, inspection, and test
- Traceability
- Flex circuit assembly & test
- RF assembly and test
- Fiber optics assembly & test
- Precision electromechanical assembly
- Final product configuration
- NPI process & prototyping
- Cable & wire routing/installation
- RF assembly and test
- Dedicated system assembly and box build services
- Dedicated NPI center
- Quick-turn prototyping
- 01005 components
- Box Build & System Integration
- Enclosure system configuration
- Complete assembly, inspection, and test
- Fine pitch and high count
- BGAs
- Package on Package (PoP)
- Chip on Board
- RF microelectronics
- Press fit connectors
- Precision Machining
- Flexible lines for high mix production and high volume requirements
- In-house boards, cables, and enclosures
- Global state-of-the –art facilities
- Wafer sawing
- Precision die placement
- In-circuit test (CT)
- Inspection and testing: SPI, AOI, Flying probe and X-Ray
- Liquid Crystal Polymer (LCP)
- Automated wire bonding
- Material dispensing
- Multi-chip assemblies
- Simple cable assemblies through to complex unit assemblies
- Final product build including unique configuration available.
- Single prototypes to full flow line assembly
- Fully automatic Cut and Strip
- Semi-automatic strip and crimp
- Full unit to unit serial number tracking available
- 5 SMT Lines (7 machines) offering a highly flexible pick and place platform (Europlacer and MyData)
- Dedicated NPI (New Product Introduction) and Fast Track line
- Fully automated placement down to 01005, 0.15mm pitch, 0.2mm Micro BGA alongside complex odd form capability
- Fully automated POP (Package on Package) placement available
- Standard LOT based batch traceability for all products with individual SerialNo/CircuitRef to LOT traceability also available
- Convection and Vapour Phase Reflow
- 100% AOI (Automatic Optical Inspection) on all SMT (Mirtec)
- Hi-Power, multi axis colour x-ray (including CT scan (Dage).
- Ersa-scope
- Standalone closed loop rework stations (PDR) for complex rework
- Fully ESD and MSL compliant
2x Lead-free Flow Solder (Blundell CMS400) and 1 x Leaded Flow solder(Blundell CMS400)- 2x Selective Solder Lines (Pillarhouse / Inertec)
- Highly experienced and skilled workforce
- All operators IPC-610 certified
- Rework operators IPC7711 / 7721 certified
- Core team of functional experts (PCA Processes, Test Processes, DFx, BOM, BTO/CTO Processes
- Engineering support for EMEA
- BOM Structure and Product launch support
- Early Engagement with Development Teams
- Factory interface and spokesperson
- Engineering change co-ordination
- Test Strategy and Test Plan Development
- Board & System Level Test Development
- Test Plan Execution and Deployment
- Test Infrastructure Standardization
- Debug and repair functions at PCBA/System level s
- Functional test Development
- CAD development analysis and programming
- Rework design centre for customer returns
- Engagement with Asia team to standardise with OSI policies
- In-house custom jig manufacturing
- Simple cable assemblies through to complex unit assemblies.
- Final product build including unique configuration available.
- and configuration
- Single prototypes to full flow line assembly
- Fully automatic Cut and Strip
- Semi-automatic strip and crimp
- Full unit to unit Serial No tracking available
